Integrated Circuit Deconstruction
Silicon Investigations offers a wide selection of services to support industry and acadamia.  Our primary focus is on intellectual property in the semiconductor industry, but we offer many other niche services.  Our semiconductor services include integrated circuit reverse engineering, detailed failure analysis of semiconductor devices.  Our engineering services include repair and retrofit of Ultra High Vacuum (UHV) systems, design and construction of new UHV systems, high voltage engineering and R&D programs working with graphene and novel vacuum tube technologies.
Silicon Investigations Logo


Silicon Investigations Services



Our areas of focus:

  • We are currently doing base research in graphene, diamond and diamond like coatings for  semiconductors and specialized vacuum tube cathodes. We have several ongoing programs in vacuum tube technology, including novel vacuum transistor devices, low work function cathodes, tunneling transistor designs and the implamentation and applications of graphene and graphene oxide.
  • We offer comprehensive reverse engineering services for semiconductors and printed circuit boards.  For semiconductor reverse engineering, we empoly a number of advanced tools, including scanning electron microscopy, optical microscopy, reactive ion etching (RIE), ion milling, chemical mechanical planarization (CMP) and wet etch capabilities.
  • We specialize in patent infringement and trade secret litigation.  We often receive requests to evaluate integrated circuits to determine if there is an infringing technology or trade secret violation.
  • We also provide additional services in the reverse engineering field, including schematic generation and the complete documentation of integrated circuits, systems and products.
  • In addition to our reverse engineering services, we also consult on intellectual property issues and patent applications.
  • We offer advanced laboratory capabilities, including Scanning Electron Microscopy, X-ray microanalysis, optical microscopy, chemical analysis, RF plasma processing & deprocessing, rective ion etching (RIE), ion milling, cryogenic optical imaging and advanced electronic testing to assist corporations with both their R&D projects and intelectual property litigation. We also offer custom decapsulation services to companies that do not have the internal ability to perform these tasks.

Additionally, we offer services tailored to the needs of  the scientific and industrial customer:

  •  Obsolete component identification/substitution
  •  Component level repair of circuit boards
  •  Schematic/documentation generation
  •  Software engineering

    Custom design:

  •  Product prototypes
  •  Manufacturing consulting
  •  Ultra high vacuum and high vacuum system design and retrofit
  •  Custom vacuum tube assemblies for high voltage switching
  • Cryogenic testing of semiconductor material/devices
  • Chemical/electronic process design and consulting

    Failure analysis and data recovery:

  •  Ability to recover data from heat/fire damaged semiconductors
  •  Sophisticated failure analysis capabilities

A partial list of our customers can be found here

For additional information, or to request a quote, please use the contact link or you may contact us by phone at 920-955-3693.





Thank you for visiting the Silicon Investigations home page.

For additional information on Silicon Investigations services, please send e-mail to [email protected], phone us at 920-955-3693, or FAX your request to 920-955-3691.

This page, and all contents, are Copyright © 2004-2016 Silicon Investigations, Ltd. Appleton, Wisconsin, USA.

Last updated April 4, 2020

Home - About Us - IC Reverse Engineering - IC Failure Analysis - Patent Services - Vacuum Tube R&D; - Graphene Research - Design Services - Vacuum Engineering - IC Decapsulation Service - Repair Service - Reference Material - Hewlett Packard (Agilent) Repair - Contact Us - Site Map

Silicon Investigations - Semiconductor Integrated Circuit Reverse Engineering About Silicon Investigations and our Abilities Intelectual Property Infringement Protection Services. Integrated Circuit failure Analysis Integrated Circuit Package Decapsulation Services Reference Material for Patent Services and integrated circuit Reverse Engineering Methods and Practice Silicon Investigations Industrial Electronic Equipment and Laboratory Equipment Repair Services High Vacuum & UHV System Chamber Design & Retrofit Services Electronic Design Services - Specializing in Quick Prototyping - chip on board COB, metallized Alumina for RF. Contact Silicon Investigations for a Quick Quotation on Your Project I.C. Integrated Circuit MCU Microcontroller Unlocking (Code Recovery) Service Semiconductor Integrated Circuit Manufacurers' Logos Identification Guide Integrated Circuit Package Reference Material - Outline Diagrams of Common Devices VME System Components for Repair and Maintenance of SBC VME Computers Agilent, Keysight, Hewlett Packard, HP Repair and Software Operating System Boot Diskettes VME System Component Inventory for Repair and Maintenance of SBC VME MVME Computers Quantum Anomaly Detector Theory - Is it Possible to Decipher the Future? EG&G (Perkin Elmer) Krytron Replacements [KN-4 KN-6, KN-6B KN-9 KN-22, KN-26] and Information on Low Jitter Plasma Trigger Tubes I.C. Integrated Circuit Reverse Engineering Service Vacuum Tube Research, Development, and Custom Scientific Instrument Design Services Graphene Research & Development I.C. Integrated Circuit MCU Microcontroller Unlocking (Code Recovery) Service DSO Nano Oscilloscope Firmware Update archive Public Domain Component Identification Information Multi layer metalization Smart card Sprytron Krytron Squib Radiation Tritium DLC - diamond like carbon Graphene nanotube Hydrogen Tokamak Fusion Stellarator Plasma Physics Gallium nitride Patent Infringement Graphene cathode Gallium arsinide Reflectometer Electron beam Gadolinium He detector Krytron Neutron Space charge Pulse Switching Carbon Investigations Wire bond Patent research He Novatek GaAs semiconductor Patenting Quantum entanglement Spark gap Current dump Magneto-optical readout Gallium Q Switch Argon Ion Mill Crack microcontroller Sapphire Electronic reverse engineering Vacuum research High Voltage Pulse Tunneling effect Boron Nitride Chipworks Audio vacuum tube Attack microcontroller Carbon Nanotube Voltage contrast Belphegor Cold cathode Intersil Patent litigation Q Switching Reactive ion etcher High fidelity tube Multi layer Laser Fault Injection Trade Mark Litigation Decapsulation Silicon substrate Layout vs Schematic Competitive analysis Hewlett Packard Rective ion etching Plama Research Trggered Spark gap Graphene transistor HV Output pulse Current dump spark gap High power microwave Platinum silicide Kauffman source Hall thruster Xray Analysis Intellectual property Quantum computing Nuclear resonance Rail Gun Mask programmed Agilent High Voltage Micro controller Graphene Beta Radiation Alpha Radiation Cyclotron Doping profile X-ray Scanning electron microscope FIB circuit edit Alumina substrates Stilbaone Conformal coatings Microprocessors Reverse engineering Mcu attack Integrated circuit Quantum symetry Quantum computing Optical Fault Injection Plasma Physics Ceramic substrates Roughing pump Glitching Mold decapsulation Patent Analysis Quantum Bit Vacuum Sprytron Tracing circuits Patented Functional Analysis Ion Milling Sandia sprytron Spectragraphic examination Analysers protocol Atomic force microscope Secure mocrocontrollers Circuit diagrams Calutron Pockels cell Electronic engineering Hughes Crossatron Leland Research Corp HV Tubes Semiconductor Die Prototype construction Tesla coil Thyratron Ion Flux Hughes Research Laboratories EDA Sprytron Crossatron Electon Microscope Laser initiated plasma channel Patent defending Encapsulation depotting Layout vs Schematic Schematic diagram Failure Analysis BiCMOS circuit lithograph Crypto processor Cryptography Deprocessing Decompiling Edax analysis Antifuse Bipolar circuit Isplsi Krypton Netlist extraction Q-carbon QBit Unscramble Vacuum transistor Vacuum deposition Microcontroller crack Focused Ion Beam Fpga Patent application Auger electron microscope Diamond like carbon Diamond semiconductor Mcu attack Americium Hewlett Packard HP3562 Agilent 3562A Hewlett Packard HP3577 Agilent 3577A Hewlett Packard HP3582 Agilent 3582A Hewlett Packard HP3585 Agilent 3585A Hewlett Packard HP4140 Agilent 4140A Hewlett Packard HP4141 Agilent 4141A Hewlett Packard HP4145 Agilent 4145A Hewlett Packard HP4155 Agilent 4155A Hewlett Packard HP4156 Agilent 4156A Hewlett Packard HP4194 Agilent 4194A Hewlett Packard HP4195 Agilent 4195A Hewlett Packard HP4352 Agilent 4352A Hewlett Packard HP5371 Agilent 5371A Hewlett Packard HP8341 Agilent 8341A Hewlett Packard HP8350 Agilent 8350A Hewlett Packard HP8510 Agilent 8510A Hewlett Packard HP8511 Agilent 8511A Hewlett Packard HP8517 Agilent 8517A Hewlett Packard HP8530 Agilent 8530A Hewlett Packard HP8560 Agilent 8560A Hewlett Packard HP8561 Agilent 8561A Hewlett Packard HP8562 Agilent 8562A Hewlett Packard HP8563 Agilent 8563A Hewlett Packard HP8564 Agilent 8564A Hewlett Packard HP8565 Agilent 8565A Hewlett Packard HP8566 Agilent 8566A Hewlett Packard HP8567 Agilent 8567A Hewlett Packard HP8568 Agilent 8568A Hewlett Packard HP8719 Agilent 8719A Hewlett Packard HP8720 Agilent 8720A Hewlett Packard HP8722 Agilent 8722A Hewlett Packard HP8751 Agilent 8751A Hewlett Packard HP8752 Agilent 8752A Hewlett Packard HP8753 Agilent 8753A Hewlett Packard HP8756 Agilent 8756A Hewlett Packard HP8757 Agilent 8757A Hewlett Packard J6800